Intel has announced that it has completed the development of two new fabrication processes, Intel 18A (1.8nm-class) and Intel 20A (2nm-class). These will be used to make the company's own products, as well as chips for clients of its Intel Foundry Services division. While the production nodes are not yet ready for commercial manufacturing, Intel has finalized all specifications, materials, requirements, and performance targets for both technologies. Intel's 20A fabrication technology relies on gate-all-around RibbonFET transistors and backside power delivery, which is a risky move but will allow Intel to outperform its competitors TSMC and Samsung Foundry. Intel plans to start using this node in the first half of 2024.
Intel's 18A manufacturing process will refine the company's RibbonFET and PowerVia technologies, and shrink transistor sizes. Development of this node is going so well that Intel has pulled in its introduction from 2025 to the second half of 2024.
Intel's fabrication technologies are being developed for both the company's own products and for chips that will be produced by its Intel Foundry Services for its foundry customers. The company has already engaged with seven of the 10 largest foundry customers and has a growing pipeline of 43 potential customers and ecosystem partner test chips.
Intel CEO Pat Gelsinger said, "Additionally, we continue to make progress on Intel 18A, and have already shared the engineering release of PDK 0.5 (process design kit) with our lead customers and expect to have the final production release in the next few weeks."
Overall, Intel's development of these new fabrication processes is a significant step towards maintaining its competitive edge in the semiconductor industry and signals its continued commitment to innovation and technological advancement.